Intel Series 300 chipsets with WiFi, Bluetooth 5.0 and USB 3.1 integrated
Intel would have included support for WiFi 802.11ac R2, USB 3.1, and Bluetooth 5.0 within its 300 Series Chips, to debut next year. The move will affect the accounts of chip making partners.
The launch of the Intel platform known as the ” Coffee Lake ” code could lead to the integration of WiFi 802.11ac R2, Bluetooth 5.0 and USB 3.1 into the 300 Series Chipsets, the launch of which is expected along with the new platform.
According to DigiTimes, Intel intends to integrate the three standards into the Series 300 Chipsets, effectively eliminating the need for third party chip makers (Broadcom, ASMedia, Realtek) to provide the same functionality.
The Santa Clara company seems to have been forced to revisit the plans for launching new products due to AMD, anticipating the launch of the Z370 chipset in August and being forced, by the time constrained, not to include additional features such as USB 3.1 and wireless capabilities.
So the news would be the chips of the 300 series that will be launched in 2018, such as H370, B350 and Z390. The Gemini Lake platform, which will be the successor to the Apollo Lake platform for low-power entry-level products, should also complement the additional features.
This move by Intel, albeit foreseeable in the general sense, will have a significant impact on the accounts of companies involved in producing the chips used so far, with Realtek in particular, expecting a significant downturn in orders.
On the other hand, the integration of technologies within the chipset should favor a reduction in device production costs and purely theoretically lead to a drop in prices.
