In the course of its 3G/LTE Summit underway in these two days in Hong Kong, the US company took the opportunity to announce two new solutions that will characterize the mid-market for next year.
Day of announcements regarding the global technology giant Qualcomm that over 3G/LTE Summit being held in this hour in Hong Kong has officially announced the modem that we will find in the new Qualcomm Snapdragon 820 but also two new SoC soon to characterize the midrange and medium / low line-up of solutions for mobile device manufacturer American.
The new chipsets are called Snapdragon 430 and Snapdragon 617 and, despite their positioning in the range offer interesting solutions regarding the course and multimedia connectivity for mid-range devices.
In particular, the new Snapdragon 430 has a modem X6 LTE, with support networks Cat 4 downlink for data rates up to 150 Mbps and uplink Cat 5, you can reach 75 Mbps thanks to its compatibility with the technologies 2×10 MHz of Carrier Aggregation. Snapdragon 430 also offers an advanced support for processing of photographic images captured with cameras in configuration dual-chamber sensors and a resolution up to 21 MP. The GPU in the new Snapdragon 430 is the recent Adreno 505, produced by the same Qualcomm, which offers support for Open GL ES3.1, Android Extesion Pack and Open CL 2.0.
In the new Snapdragon 617, which provides connectivity and even better performance than Snapdragon 430, we find solutions that until now were exclusive of high-level chipset. To respond to the increasingly insistent demands of increasingly rapid connectivity we find within this SoC LTE modem X8, with support Cat 7 for download speeds of up to 300 Mbps and upload speeds up to 100 Mbps thanks to the technologies of carrier aggregation bi directional 2×20 Mhz.
Both new series processors Snapdragon above are based on CPU ARM Cortex A53 octa-core configuration, particularly Optimized to be extremely efficient from the point of view of energy consumption. Snapdragon 430 and 617 also provide support to the new technology Qualcomm Quick Charge 3.0 and using the new DSP Qualcomm Hexagon, for the management of low power sensors.
The first devices to bring a dowry the new Snapdragon 430 will be marketed in the second quarter of 2016 while the solutions equipped with the new Snapdragon 617 could see the light as early as the end of this year 2015.